The gold layer used by Bonding is generally soft gold. Both chemical gold and electrogilding can be used in theory, but it must have sufficient thickness.
Due to different operating conditions and different base materials, the required minimum gold plating thickness is also different.
Hard gold contains more impurities, so the binding force in the wire laying operation cannot be fully formed, so hard gold is not suitable for wire laying.
Therefore, if it is hard gold, I'm afraid that the gold wire used for the wire cannot penetrate the gold plating layer, so in theory, hard gold is not suitable for the wire.
For the chip packaged with wire bond, the maximum length of the bonding wire is generally 4.5~5mm.
If the length is too long, it is easy to cause defects due to the collapse of the bonding wire when packaging.
The smaller the die size of the chip, the longer the bonding wire may be required.
The smaller the EPAD, the longer the fingers of the leadframe can be extended, and the bonding wire length can be shortened.
LEAVE US A MESSAGE
When your product is still in the design stage, we are very willing to participate in your product design, and our engineers will give you advice on the design, performance, cost of PCB to help you reduce the cost of PCB and provide valuable help to bring your product to market quickly and successfully.
Our products extensively find their applications from the market due to nice properties. We Provide pcb manufacturing & pcb assembly. Welcome!