High-Frequency PCB



With high-frequency PCB, you can get many benefits, such as:


Fewer vias in connection

Make sure there are fewer vias in the connection, because when you use vias, they produce a 5 x 10-13F distributed capacitance. Therefore, reducing the via will lead to a sharp increase in speed. In addition, it reduces the chance of data errors.

Make high-frequency lead longer

In this step, the science is that the routing length of the signal line is proportional to the radiation intensity. With this in mind, this means that when the high-frequency lead is long, you will find that its components are easily coupled.

Reduce bending

Convective heat is dissipated by transferring heat to water or air. Therefore, it allows Reduce the bending between the pins on the high-frequency board. In most cases, it is better to use a complete straight line when wiring HF boards. If you must break, use an arc break or a 45 degree polyline. Therefore, you will improve the bonding strength of copper foil in low-frequency circuits. However, this step is not necessary for high frequency circuits. This is because it reduces external emissions.

Reduce crosstalk

Convective heat is dissipated by transferring heat to water or air. Therefore, it allows Do not take signal line crosstalk for granted. Crosstalk occurs between signal lines lacking direct connection. Therefore, it is better to reduce crosstalk in high-frequency signals.

Try to avoid circulation

Convective heat is dissipated by transferring heat to water or air. Therefore, it allows Try not to have loops when wiring HF boards. If they happen, make them very small.



Plate thickness 0.4 – 5.0 mmMaterials RO3010, RO4350B, RT5880, RO4003C, RO3003
Polypropylene Domestic - (6700), Rogers 4450F, etcOrder quantity No MOQ
Screen printing surface It depends on the document.Color of solder mask Blue, red, yellow, green, white
Number of floors 2 – 40Quality grade Standard IPC 2
Alternative methods Countersink, gold finger,  peelable soldering tin, mask carbon oilPlate size 0.4-5.0 mm
Silk screen color black, yellow, whiteMinimum drilling diameter 0.15 mm
Surface treatment Tin deposition – RoHS, ENIG – RoHS, gold plating – RoHS, silver deposition – RoHSWeight of finished copper 0.5 – 2.0 0z
Manufacturing time This depends on the project (10 days to 5 weeks)Minimum ring 0.1 mm
Minimum tracing 3mil/3milImpedance tolerance ± 10%
  • Q
    How to select high frequency pcb/High speed PCB materials?
    For material selection, FR-4 material is a common laminated material. In addition to the alumina substrate, other substrate materials (such as PPO and Teflon) can also be used as frequency laminates. In addition, the material combination, dielectric material and carrier substrate of PCB substrate should also be considered.
  • Q
    How to deal with the signal integrity problem in high-frequency signal transmission?
    Signal integrity measures these signal distortions in the high frequency range. Signal trace, signal layer and signal energy may affect the effective transmission of signals. For more information about high-speed signals, please contact our team.
  • Q
    What should be considered in high-frequency PCB design/high-frequency design?
    First, consider the design rules of circuit design, such as PCB layout design and design process in electronic design. In addition, your high-frequency application determines the circuit performance you need. Such as characteristic impedance, mechanical strength, thermal characteristics (thermal expansion), chemical resistance, loss tangent and heat dissipation. Then, layer thickness, PCB components (key components) of electronic devices, digital circuits, conductive layers. In addition, antenna array, antenna efficiency and conductor loss are also important factors to be considered.

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