High frequency PCB is very suitable for applications involving special signal transmission between equipment. These PCB also involve using special materials to achieve high frequencies. Compared with traditional PCB, high-frequency PCB generates smaller high-frequency signal impedance.
When electronic equipment and products need special signal requirements, high-frequency PCB can be used. Its working environment is 500MHz – 2GHz. Therefore, they are ideal for high-end applications. Today, the complexity of electronic devices is increasing rapidly. Therefore, we need high-frequency PCB to provide faster signal transmission.
We have rich test methods, such as AOI test, E-Test, X-RAY, impedance control, high temperature and high humidity, high and low temperature cycle and other advanced test technologies to ensure quality.
FR4, high TG FR4, high-frequency material, Rogers PCB, metal based PCB. Excellent one-to-one customer service (individual to individual).
WHAT IS A HIGH FREQUENCY PCB?
Are you working on a wireless network or application that contains specific signal transmissions between objects? Then consider buying a high-frequency PCB. The frequency range of these PCBs is 500MHz to 2GHz. You can use them in different applications, such as high-speed design applications, microwaves, mobile phones, and so on.
This type of PCB has many signal sensitivities. Therefore, it has high-frequency laminates to help maintain heat transfer for the application. In addition, the type of HF board you choose will determine the overall performance of your signal. Any change in the dielectric constant of the material will affect the impedance of the circuit board.
HIGH FREQUENCY CIRCUIT BOARD
Main features of high frequency circuit board
◈ Small and stable. In addition, there is no delay in signal transmission. Ideal for signal transmission. And effectively reduce signal waste. The copper free foil separates with temperature change.
◈ HF board with low water absorption.
Impressive properties such as impact resistance, heat resistance, peel resistance and chemical resistance. In addition, the high peel resistance improves the signal quality of PCB.
Materials required for high frequency circuit boards
◈ Because high-frequency PCB layouts work at high frequencies, they often suffer from extremely high temperatures.
◈ If the material is unsuitable, it may lead to thermal stress accumulation. Therefore, we need to choose a material with a good coefficient of thermal expansion (CTE). In addition, the material shall have high dimensional stability. This way it will not be degraded at runtime.
◈ We usually use these materials for advanced applications. Therefore, the materials we use for manufacturing should have excellent thermal conductivity and electrical conductivity.
◈ We often deploy high-frequency PCB in extreme environments. Therefore, they should have high corrosion resistance and moisture resistance. Therefore, the materials we use to make high-frequency PCB should be moisture-proof. High frequency signals are very sensitive to noise. Therefore, we need to use materials with stricter impedance tolerance to manufacture these PCBs.
THE FOLLOWING TABLE EXPLAINS THE PROPERTIES OF EACH MATERIAL:
Some of the materials we use are Taconic TLX, Rogers, ISOLA IS620 E-glass fiber, etc.
HIGH FREQUENCY PCB IS USED IN ALMOST EVERY INDUSTRY
High frequency PCB is used in almost every industry. We also interact with them in our daily life. You can see high-frequency PCB in ATM machines, vending machines, computers in banks, mobile phones for browsing the Internet, and Wi Fi routers in homes or offices.
◈ Network communication, especially network communication involving signal integrity verification.
◈ Manufacture of small equipment involving small circuit layout.
◈ Design modules for devices that require excellent impedance control.
◈ Installed electronic devices for consumers, such as digital counters at airports. We use high-frequency PCB in it, because these machines need advanced control, they can process large amounts of data and interact with customers in a short time interval. Design and manufacture high-speed digital test boards for various signals. Therefore, this includes the test of RF signal roll off. Manufacturing highly intensive medical equipment can run at high speed, but at low cost.
◈ Automobile radar system.
◈ Millimeter wave applications.
◈ Global positioning satellite antenna.
With high-frequency PCB, you can get many benefits, such as:
WHY SHOULD YOU CONSIDER HIGH-FREQUENCY CIRCUIT BOARDS:
◈ Reduce moisture content
When moisture is involved, a small amount will distort the electrical performance of the high-frequency board. Interestingly, compared with traditional FR-4, the humidity level of PTFE and other materials is as low as 2%. The rating of FR-4 is very high, about 50%. As a result, the reduced moisture content translates into significant electrical performance.
◈ Excellent thermal management
Most of the time, high-frequency PCB will generate a lot of heat during operation. Therefore, with polyimide and other materials, you can rest assured that you will obtain strong thermal performance. In addition, you can use them in harsh environments.
◈ It has a controlled impedance
The board contains materials that maintain a Dk tolerance of+/- 2% or more. This means it is very useful for circuits that require strict impedance control.
Most of the time, high
◈ Comprehensive and excellent signal performance
Because of its PTFE material, the dissipation factor is low. This also means that it reduces signal loss.
◈ It has dimensional stability
High frequency PCB has thermosetting hydrocarbon material. These materials promote mechanical stability.
◈ High frequency PCB design and layout
Make sure there are fewer vias in the connection, because when you use vias, they produce a 5 x 10-13F distributed capacitance. Therefore, reducing the via will lead to a sharp increase in speed. In addition, it reduces the chance of data errors.
In this step, the science is that the routing length of the signal line is proportional to the radiation intensity. With this in mind, this means that when the high-frequency lead is long, you will find that its components are easily coupled.
Convective heat is dissipated by transferring heat to water or air. Therefore, it allows Reduce the bending between the pins on the high-frequency board. In most cases, it is better to use a complete straight line when wiring HF boards. If you must break, use an arc break or a 45 degree polyline. Therefore, you will improve the bonding strength of copper foil in low-frequency circuits. However, this step is not necessary for high frequency circuits. This is because it reduces external emissions.
Convective heat is dissipated by transferring heat to water or air. Therefore, it allows Do not take signal line crosstalk for granted. Crosstalk occurs between signal lines lacking direct connection. Therefore, it is better to reduce crosstalk in high-frequency signals.
Convective heat is dissipated by transferring heat to water or air. Therefore, it allows Try not to have loops when wiring HF boards. If they happen, make them very small.
CHALLENGES AND SOLUTIONS OF ALUMINUM SUBSTRATE
◈ Microstrip Method
◈ Stripline Method
The stripline method is similar to the microstrip line, the only difference is that the stripline has an additional group plane. The group plane is above the trace. When using this method, be sure to place the route between two planes. This method is a better choice. The reason is that there is EMI radiation in two planes.
OUR GENERAL MANUFACTURING CAPABILITY?
|Plate thickness||0.4 – 5.0 mm||Materials||RO3010, RO4350B, RT5880, RO4003C, RO3003|
|Polypropylene||Domestic - (6700), Rogers 4450F, etc||Order quantity||No MOQ|
|Screen printing surface||It depends on the document.||Color of solder mask||Blue, red, yellow, green, white|
|Number of floors||2 – 40||Quality grade||Standard IPC 2|
|Alternative methods||Countersink, gold finger, peelable soldering tin, mask carbon oil||Plate size||0.4-5.0 mm|
|Silk screen color||black, yellow, white||Minimum drilling diameter||0.15 mm|
|Surface treatment||Tin deposition – RoHS, ENIG – RoHS, gold plating – RoHS, silver deposition – RoHS||Weight of finished copper||0.5 – 2.0 0z|
|Manufacturing time||This depends on the project (10 days to 5 weeks)||Minimum ring||0.1 mm|
|Minimum tracing||3mil/3mil||Impedance tolerance||± 10%|