What is HDI PCB High density interconnects (HDI) PCB, represent one of the fastest-growing technologies in PCBs. Because of its higher circuitry density than traditional circuit boards, the HDI PCB design can incorporate smaller vias and capture pads, and higher connection pad densities. HDI Boards contain blind and buried vias and often contain micro vias of 0.006 or less in diameter. By using HDI technology, designers now can place more components on both sides of the raw PCB if desired. Now as the development of via in pad and blind via technology, it allows designers to place smaller components closer together. This means faster transmission of signals and a significant reduction in signal loss and crossing delays. HDI PCB is frequently found in mobile phones, touch-screen devices, laptop computers, digital cameras, 4G network communications, also prominently featured in medical devices
Layer: 10 SolderMask Color: BlueSilkscreen Color: WhiteSurface Treatment: ENIG Thickness: 1.34±0.14mmWidth/Space: 0.1/0.1mmSpecial Technology: Impedance control This HDI PCB board is panalized by 4 pieces, surface treatment is ENIG. ENIG, which can be useful and achieve good electrical performance in the long term use of PCB.What’s more, it also has environmental tolerance than other surface treatment processes do not.Nickel plating is because gold and copper diffuse to each other, and the nickel layer can prevent the diffusion between them.
Layers: 4SolderMask Color: Green Silkscreen Color: White Surface treatment: ENIG Board thickness: 1.2mmMin hole size: 0.075mmMin line width/space: 0.1/0.1mmParticularity: 2-order HDI, blind hole, buried holeBlind and buried vias are only available on boards with at least four layers. Blind Vias is Connects an inner layer with the adjacent surface layer, they are only visible on one side of the boards and so are called 'blind' vias. Buried Vias is Connects two adjacent inner copper layers. They are not visible from the surface and so are 'buried'.Hdi board buried and blind vias connect the inner layers with either other adjacent inner layers or adjacent surface layers.
Surface treatment: ENIG Board thickness: 1.3mmMin hole size: 0.1mmMin line width/space: 0.1/0.1mmParticularity: 1st order HDI, blind hole huried holeApplication: automotive Immersion gold can improve the surface treatment of the PCB board. To put it simply, immersion gold is a method of chemical deposition, which produces a metal coating on the surface of the circuit board through a chemical oxidation-reduction reaction.The advantage of the Immersion Gold process is that the color deposited on the surface.That is very stable when the circuit is printed, the brightness is very good, the coating is very flat, and the solderability is very good.
Layer: 8 SolderMask Color: Green Silkscreen Color: White Thickness: 1.6mm±0.16Special Technology: Rogers+FR4，Rf antenna line width control +/-5um PCB manufacturers have also begun to study the processing of various high-frequency products and the application of low-cost solutions, such as high-frequency products. The mixing of high-frequency materials and ordinary FR-4 is to embed high-frequency materials in ordinary FR-4 materials. However, this method has problems such as poor flatness of the board formed by high-frequency materials and FR-4 materials. Resulting in large size of the shielding cover is poorly attached and the problem of welding gaps.