MARKETS WE SERVE
SUPPORTS INNOVATIVE, ADVANCED TECHNOLOGY APPLICATIONS REQUIRING OR ENABLING 5G
Camtech PCB provides active and passive products for a wide variety of commercial and non-commercial applications. From Wi-Fi differential input baluns used in brand name manufacturer products to SMT components used in conjunction with market-leading RF integrated circuits and more. We continue to invest in the processes and capabilities that
our customers need now and will need as technology advances.
Including anylayer HDI: All the layers of a PCB are high-density interconnection layers that allow the conductors on any PCB layer to be interconnected with copper-filled stacked microvia structures ("anylayer via"). This provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld devices.
High Performance, High-Density Solutions for Advanced Applications
CONTACT OUR EXPERTS
5G connectivity is an area of focus for TTM Technologies; our experts are here to help.
Ask your question or tell us about a challenge and we will work with you and your team to find a complete solution that meets your needs—no project is too big, or too small.
ENGINEERED EXPERTISE & SOLUTIONS TO BRING 5G APPLICATIONS TO LIFE
Camtech PCB offers engineered solutions for massive MIMO, beamforming, 5G base stations and other enablement infrastructure and components. Camtech PCB Technologies has unique relationships with game-changing innovators around the world. As our customers develop technologies to enable 5G or technologies reliant on 5G, Camtech PCB's engineering experts are ready with solutions for wireless connectivity, Industry 4.0, IoT for medical, automotive cellular vehicle-to-everything (C-V2X), mission-critical safety applications, networking, computing, and communications.
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