Camtech PCB focuses on high density PCB manufacturing .

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Networking & Communications Capabilities

Industry-leading, Advanced PCB and Technology Solutions for Telecommunications & Networking Applications.
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CAMTECH PCB'S
LEADING-EDGE CAPABILITIES DELIVER RELIABLE ADVANCED TECHNOLOGY SOLUTIONS

We are recognized as an industry- professional provider of advanced technology PCB product solutions across the telecommunications & networking market. Our key telecommunications manufacturing facilities are TL9000 certified and provide our customers with the highest levels of technology and quality.

 

Camtech PCB has expertise in RF and specialty components, engineered thermal solutions, and advanced photonics packaging that set us apart from other PCB manufacturers. Our value goes beyond PCB and offers an integrated, ​​​​​​​

complete solution to support your full product lifecycle.

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CAMTECH PCB 
HAS A NUMBER OF SOLUTIONS AND BROAD EXPERTISE FOR NETWORKING AND TELECOMMUNICATIONS APPLICATIONS​​​​​​​


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    • CONVENTIONAL PCBS
      Conventional PCBs can be any layer count but rely on conventional drilling and plating technology.
    • CONVENTIONAL PCBS
    • RF / MICROWAVE PCBS
      All cellular devices require a network of base stations to function. The base station antennas transmit and receive RF signals, or radio waves, to and from mobile phones near the base station.
    • RF / MICROWAVE PCBS
    • HIGH-DENSITY INTERCONNECT ( HDI )PCBS
      HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products.
    • HIGH-DENSITY INTERCONNECT ( HDI )PCBS
    • RF AND SPECIALTY COMPONENTS
      Camtech PCB manufactures a range of passive components used extensively in cellular base stations and tower mounted hardware. These products are critical signal path products that allow our customers the highest levels of performance while keeping costs down. We also offer expertise in advanced photonics packaging, engineered thermal solutions, and integrated RF solutions. Our teams have deep expertise in this area and we continue to offer differentiated products that support our innovative customer-base.
    • RF AND SPECIALTY COMPONENTS

GENERAL NETWORKING & COMMUNICATIONS CAPABILITIES


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High Layer-Count
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Laser Microvias
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Advanced Materials
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High-Volume 2.0 Core Material
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Hybrid & Sequential Structures
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Thermal Management Solutions
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Oversized Line Card and Backplaned
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Advanced And Conventional  High-Density  Interconnect(Hdi) Pcbs

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 The first thing we do is meeting with our clients and talk through their goals on a future project. During this meeting, feel free to communicate your ideas and ask lots of questions.
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